View MS580330BA01-00_8864671.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

sensor solutions ///ms5803-30ba page 1 09/2015 ms5803-30ba miniature 30 bar module specifications ? high resolution module, 0.5 mbar ? fast conversion down to 1 ms ? low power, 1 a (standby < 0.15 a) ? integrated digital pressure sensor (24 bit ? adc) ? supply voltage 1.8 to 3.6 v ? operating range: 0 to 30 bar, -40 to +85 c ? i 2 c and spi interface (mode 0, 3) ? no external components (internal oscillator) ? excellent long term stability ? hermetically sealable for outdoor devices ? high endurance (he version) the ms5803-30ba is a new generation of high resolution pressure sensors with spi and i2c bus interface. the ms5803- 30a he is the high endurance pad technology version of the ms5803-30ba pressure sensor module. it is optimized for depth measurement systems with a water depth resolution of 2.5cm and below. the sensor module includes a high linear pressure sensor and an ultra low power 24 bit ? adc with internal factory calibrated coefficients. it provides a precise digital 24 bit pressure and temperature value and different operation modes that allow the user to optimize for conversion speed and current consumption. a high resolution temperature output allows the implementation of a depth measurement systems and thermometer function without any additional sensor. the ms5803- 30ba can be interfaced to any microcontroller. the communication protocol is simple, without the need to programming internal registers in the device. the gel protection and antimagnetic stainless steel cap make the module water resistant. this new sensor module generation is based on leading mems technology and latest benefits from meas switzerland's proven experience and know-how in high volume manufacturing of pressure modules have been widely used for over a decade. this sensing principle employed leads to very low hysteresis and high stability of both pressure and temperature signal.
ms5803-30ba miniature 30 bar module sensor solutions ///ms5803-30ba 09/2015 page 2 features field of application mobile water depth measurements systems diving computers adventure or multi-mode watches high endurance pad technology (he version) technical data sensor performances (v dd = 3 v) pressure min typ max unit range 0 30 bar adc 24 bit resolution (1) 2.5 / 1.5 / 1 / 0.75 / 0.5 mbar accuracy 0c to +40c, 0 to 6 bar (2) - 50 +50 mbar accuracy -40c to + 85c 0 to 6 bar (2) - 100 +100 mbar response time 0.5 / 1.1 / 2.1 / 4.1 / 8.22 ms long term stability - 50 mbar/yr temperature min typ max unit range - 40 +85 c resolution <0.01 c accuracy -0.8 +0.8 c notes: (1) oversampling ratio: 256 / 512 / 1024 / 2048 / 4096 (2) with autozero at one pressure point functional block diagram vdd gnd ps sclk sdo sdi/sda meas. mux adc digital interface memory (prom) 128 bits sensor sgnd +in -in dig. filter sensor interface ic pga csb
ms5803-30ba miniature 30 bar module sensor solutions ///ms5803-30ba 09/2015 page 3 performance specifications absolute maximum ratings parameter symbol conditions min. typ. max unit supply voltage v dd -0.3 +4.0 v storage temperature t s - 40 +125 c overpressure p max iso 6425 50 bar maximum soldering temperature t max 40 sec max 250 c esd rating human body model -4 +4 kv latch up jedec standard no 78 - 100 +100 ma electrical characteristics parameter symbol conditions min. typ. max unit operating supply voltage v dd 1.8 3.0 3.6 v operating temperature t - 40 +25 +85 c supply current (1 sample per sec.) i dd osr 4096 2048 1024 512 256 12.5 6.3 3.2 1.7 0.9 a peak supply current during conversion 1.4 ma standby supply current at 25c 0.02 0.14 a vdd capacitor from vdd to gnd 100 nf analog digital converter (adc) parameter symbol conditions min. typ. max unit output word 24 bit conversion time t c osr 4096 2048 1024 512 256 7.40 3.72 1.88 0.95 0.48 8.22 4.13 2.08 1.06 0.54 9.04 4.54 2.28 1.17 0.60 ms
ms5803-30ba miniature 30 bar module sensor solutions ///ms5803-30ba 09/2015 page 4 performance specifications (continued) pressure output characteristics (v dd = 3 v, t = 25c unless otherwise noted) parameter conditions min. typ. max unit operating pressure range p range full accuracy 0 30 bar absolute accuracy, temperature range 0 40 c 0 6 bar 0 20 bar 0 30 bar - 50 - 100 - 250 +50 +100 +250 mbar absolute accuracy, temperature range - 40 85 c 0 6 bar 0 20 bar 0 30 bar - 100 - 200 - 400 +100 +200 +400 mbar maximum error with supply voltage (1) v dd = 1.8 v 3.6 v +/ - 50 mbar long -term stability - 50 mbar/yr resolution rms osr 4096 2048 1024 512 256 0.5 0.75 1 1.5 2.5 mbar (1) with autozero at 3v point temperature output characteristics (v dd = 3 v, t = 25c unless otherwise noted) parameter conditions min. typ. max unit absolute accuracy 0 10 bar -20..85c -40..85c -0.8 -2.0 -4.0 +0.8 +2.0 +4.0 c maximum error with supply voltage(1) v dd = 1.8 v 3.6 v +/ -0.5 c resolution rms osr 4096 2048 1024 512 256 0.002 0.003 0.005 0.008 0.012 c (1) with autozero at 3v point +
ms5803-30ba miniature 30 bar module sensor solutions ///ms5803-30ba 09/2015 page 5 performance specifications (continued) digital inputs (ps, csb, din, sclk, sda, scl) parameter symbol conditions min. typ. max unit serial data clock sclk spi protocol 20 mhz serial data clock scl i2c protocol 400 khz input high voltage v ih pins csb 80% v dd 100% v dd v input low voltage v il 0% v dd 20% v dd v input leakage current i leak25c at 25c 0.15 a cs low to first sclk rising tcsl 21 ns cs low from last sclk falling tcsh 21 ns digital outputs (dout, sda, scl) parameter symbol conditions min. typ. max unit output high voltage v oh i source = 0.6 ma 80% v dd 100% v dd v output low voltage v ol i sink = 0.6 ma 0% v dd 20% v dd v load capacitance c load 16 pf
ms5803-30ba miniature 30 bar module sensor solutions ///ms5803-30ba 09/2015 page 6 performance characteristics pressure error vs pressure and temperatu re temperature error vs temperature pressure and temperature error vs power supply -500.00 -400.00 -300.00 -200.00 -100.00 0.00 100.00 200.00 300.00 400.00 500.00 0 5000 10000 15000 20000 25000 30000 pressure error [mbar] pressure [mbar] absolute pressure accuracy with 2nd order compensat ion typical 85 25 - 40 -400.0 -300.0 -200.0 -100.0 0.0 100.0 200.0 300.0 400.0 - 40 - 20 0 20 40 60 80 pressure error [mbar] temperature [ c] pressure accuracy vs temperature typical 30000mbar 2nd order 14000 mbar 2nd order 30000 mbar 1st order 14000mbar 1st order -2.0 0.0 2.0 4.0 6.0 8.0 10.0 - 40 - 20 0 20 40 60 80 temperature error [ c] temperature [ c] temperature accuracy vs temperature typical 30000mbar 2nd order 1000 mbar 2nd order 30000mbar 1st order 1000 mbar 1st order -50.0 -30.0 -10.0 10.0 30.0 50.0 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 pressure error [mbar] supply voltage [v] pressure error vs supply voltage at 25c typical 1000 mbar 4000 mbar 6000 mbar 14000 mabr -0.5 -0.3 -0.1 0.1 0.3 0.5 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 temperature error [ c] supply voltage [v] temperature error vs supply voltage at 25c typical 1000 mbar 4000 mbar 6000 mbar 14000 mbar
ms5803-30ba miniature 30 bar module sensor solutions ///ms5803-30ba 09/2015 page 7 functional description figure 1: block diagram of ms5803-30ba general the ms5803-30ba consists of a piezo-resistive sensor and a sensor int erface ic. the main function of the ms5803- 30ba is to convert the uncompensated analogue output voltage from the piezo-resis tive pressure sensor to a 24- bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor. factory calibration every module is individually factory calibrated at two temperatures and t wo pressures. as a result, 6 coefficients necessary to compensate for process variations and temperature variations are calc ulated and stored in the 128- bit prom of each module. these bits (partitioned into 6 coefficients w1 to w6) must be read by the microcontroller software and used in the program converting d1 and d2 into compensated pressure and temperature values. the 2 coefficients w0 and w7 are for factory configuration and crc. serial interface the ms5803-30ba has built in two types of serial interfaces: spi and i 2 c. pulling the protocol select pin ps to low selects the spi protocol, pulling ps to high activates the i 2 c bus protocol. pin ps mode pins used high i 2 c sda, scl, csb low spi sdi, sdo, sclk, csb spi mode the external microcontroller clocks in the data through the input sclk (serial clock) and sdi (serial data in). in the spi mode module can accept both mode 0 and mode 3 for the clock polarity and phas e. the sensor responds on the output sdo (serial data out). the pin csb (chip select) is used to enable/disable the interface, so that other devices can talk on the same spi bus. the csb pin can be pulled high after the c ommand is sent or after the end of the command execution (for example end of conversion). the best noise performanc e from the module is obtained when the spi bus is quiet and without communication to other devices duri ng the adc conversion in progress. vdd gnd ps sclk / scl sdo sdi / sda meas. mux adc digital interface memory (prom) 128 bits sensor sgnd +in - in dig. filter sensor interface ic pga csb
ms5803-30ba miniature 30 bar module sensor solutions ///ms5803-30ba 09/2015 page 8 i 2 c mode the external microcontroller clocks in the data through the input sclk (serial clock) and sda (serial data). the sensor responds on the same pin sda which is bidirectional for the i 2 c bus interface. so this interface type uses only 2 signal lines and does not require a chip select, which can be favorable to reduc e board space. in i 2 c- mode the complement of the pin csb (chip select) represents the lsb of the i 2 c address. it is possible to use two sensors with two different addresses on the i 2 c bus. the pin csb shall be connected to vdd or gnd (do not leave unconnected!). pin csb address (7 bits) high 0x76 (1110110 b) low 0x77 (1110111 b) commands the ms5803-30ba has only five basic commands: 1. reset 2. read prom (128 bit of calibration words) 3. d1 conversion 4. d2 conversion 5. read adc result (24 bit pressure / temperature) size of each command is 1 byte (8 bits) as described in the table below. after adc read commands th e device will return 24 bit result and after the prom read 16bit result. the address of the prom is embedded inside of the prom read command using the a2, a1 and a0 bits. command byte hex value bit number 0 1 2 3 4 5 6 7 bit name prm cov - typ ad2/ os2 ad1/ os1 ad0/ os0 stop command reset 0 0 0 1 1 1 1 0 0x1e convert d1 (osr=256) 0 1 0 0 0 0 0 0 0x40 convert d1 (osr=512) 0 1 0 0 0 0 1 0 0x42 convert d1 (osr=1024) 0 1 0 0 0 1 0 0 0x44 convert d1 (osr=2048) 0 1 0 0 0 1 1 0 0x46 convert d1 (osr=4096) 0 1 0 0 1 0 0 0 0x48 convert d2 (osr=256) 0 1 0 1 0 0 0 0 0x50 convert d2 (osr=512) 0 1 0 1 0 0 1 0 0x52 convert d2 (osr=1024) 0 1 0 1 0 1 0 0 0x54 convert d2 (osr=2048) 0 1 0 1 0 1 1 0 0x56 convert d2 (osr=4096) 0 1 0 1 1 0 0 0 0x58 adc read 0 0 0 0 0 0 0 0 0x00 prom read 1 0 1 0 ad2 ad1 ad0 0 0xa0 to 0xae figure 2: command structure
ms5803-30ba miniature 30 bar module sensor solutions ///ms5803-30ba 09/2015 page 9 pressure and temperature calculation figure 3: flow chart for pressure and temperature reading and software c ompensation. size ?[1] [bit] min max c1 pressure sensitivity | sens t1 unsigned int 16 16 0 65535 29112 c2 pressure offset | off t1 unsigned int 16 16 0 65535 26814 c3 temperature coefficient of pressure sensitivity | tcs unsigned int 16 16 0 65535 19125 c4 temperature coefficient of pressure offset | tco unsigned int 16 16 0 65535 17865 c5 reference temperature | t ref unsigned int 16 16 0 65535 32057 c6 temperature coefficient of the temperature | tempsens unsigned int 16 16 0 65535 31305 d1 digital pressure value unsigned int 32 24 0 16777216 4944364 d2 digital temperature value unsigned int 32 24 0 16777216 8198974 dt difference between actual and reference temperature [2] dt = d2 - t ref = d2 - c5 * 2 8 signed int 32 25 -16776960 16777216 -7618 1971 = 19.71 c off offset at actual temperature [3] off = off t1 + tco * dt = c2 * 2 16 + (c4 * dt ) / 2 7 signed int 64 41 -8589672450 12884705280 1756219057 sens sensitivity at actual temperature [4] sens = sens t1 + tcs * dt = c1 * 2 15 + ( c3 * dt ) / 2 8 signed int 64 41 -4294836225 6442352640 953372897 59998 = 5999.8 mbar notes [1] [2] [3] [4] calculate temperature compensated pressure 8500 -4000 temp 41 convert calibration data into coefficients (see bit pattern of w1 to w4) variable example / typical value recommended variable type description | equation signed int 32 actual temperature (-4085c with 0.01c resolution) temp = 20c + dt * tempsens = 2000 + dt * c6 / 2 23 read digital pressure and temperature data signed int 32 temperature compensated pressure (030bar with 0.1mbar resolution) p = d1 * sens - off = (d1 * sens / 2 21 - off) / 2 13 min and max have to be defined min and max have to be defined min and max have to be defined maximal size of intermediate result during evaluation of variable 300000 0 58 p start maximum values for calculation results: p min = 0mbar p max = 30bar t min = -40c t max = 85c t ref = 20c read calibration data (factory calibrated) from prom read digital pressure and temperature data calculate temperature calculate temperature compensated pressure display pressure and temperature value
ms5803-30ba miniature 30 bar module sensor solutions ///ms5803-30ba 09/2015 page 10 second order temperature compensation yes no sens2 = 5 ? (temp C 2000) 2 / 2 3 sens = sens - sens2 temp<20c low temperature off2 = 1 ? (temp C 2000) 2 / 2 4 off2 = 3 ? (temp C 2000) 2 / 2 1 off = off - off2 temp = temp - t2 low temperature high temperature calculate pressure and temperature temp<-15c no yes off2 = off2 + 7 ? (temp + 1500) 2 low temperature very low temperature sens2 = 0 t2 = 3 ? dt 2 / 2 33 t2 = 7 ? dt 2 / 2 37 sens2 = sens2 + 4 ? (temp + 1500) 2 figure 4: flow chart for pressure and temperature to the optimum accu racy.
ms5803-30ba miniature 30 bar module sensor solutions ///ms5803-30ba 09/2015 page 11 spi interface reset sequence the reset sequence shall be sent once after power-on to make sure that the calibration prom gets loaded into the internal register. it can be also used to reset the device rom from an unknown condition figure 5: reset command sequence spi (mode 0) figure 6: reset command sequence spi (mode 3) 0 1 2 3 4 5 6 7 sclk csbsdi sdo ps 2.8ms reload 0 1 2 3 4 5 6 7 sclk csbsdi sdo ps 2.8ms reload
ms5803-30ba miniature 30 bar module sensor solutions ///ms5803-30ba 09/2015 page 12 conversion sequence the conversion command is used to initiate uncompensated pressure (d1) or uncompensated temperature (d2) conversion. the chip select can be disabled during this time to communicate with other devices. after the conversion, using adc read command the result is clocked out with the ms b first. if the conversion is not executed before the adc read command, or the adc read command is repeated, it will give 0 as the output result. if the adc read command is sent during conversion the result will be 0, the conv ersion will not stop and the final result will be wrong. conversion sequence sent during the already started con version process will yield incorrect result as well. figure 7: conversion out sequence, typ=d1, osr = 4096 figure 8: adc read sequence prom read sequence the read command for prom shall be executed once after reset by the user to read the content of the calibration prom and to calculate the calibration coefficients. there are in total 8 addres ses resulting in a total memory of 128 bit. address 0 contains factory data and the setup, addresses 1-6 calibration coefficients and address 7 contains the serial code and crc. the command sequence is 8 bits long with a 16 bit result which is clocked with the msb first. figure 9: prom read sequence, address = 011 (coefficient 3). 0 1 2 3 4 5 6 7 sclk csbsdi sdo ps 8.22ms adc conversion 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 27 28 29 30 31 sclk csbsdi sdo ps reading 24bit adc result msb first sclk csbsdi sdo ps reading 16bit prom value msb first 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 18 19 20 21 22 17 23
ms5803-30ba miniature 30 bar module sensor solutions ///ms5803-30ba 09/2015 page 13 i 2 c interface commands each i 2 c communication message starts with the start condition and it is ended with the stop condition. the ms5803-30ba address is 111011cx, where c is the complementary value of the pin csb . since the ic does not have a microcontroller inside, the commands for i 2 c and spi are quite similar. reset sequence the reset can be sent at any time except when the power on did not work it could b e possible that the acknowledge blocks the sda. when sda is blocked by an undefined state the only way to get the ms5803-30ba to work is to send a power on reset. figure 10: i 2 c reset command conversion sequence a conversion can be started by sending the command to ms5803-30ba. when comm and is sent to the system it stays busy until conversion is done. when conversion is finished the dat a can be accessed by sending a read command, when an acknowledge appears from the ms5803-30ba, you may then sen d 24 sclk cycles to get all result bits. every 8 bit the system waits for an acknowledge signal. figure 11: i 2 c command to initiate a pressure conversion (osr=4096, typ=d1) figure 12: i 2 c adc read sequence figure 13: i 2 c pressure response (d1) on 24 bit from ms5803-30ba 1 1 1 0 1 1 csb 0 0 0 0 0 1 1 1 1 0 0 s w a a p from master s = start condition w = write a = acknowledge from slave p = stop condition r = read n = not acknowledge cmd byte device address device address command 1 1 1 0 1 1 csb 0 0 0 1 0 0 1 0 0 0 0 s w a a p from master s = start condition w = write a = acknowledge from slave p = stop condition r = read n = not acknowledge command cmd byte device address device address 1 1 1 0 1 1 csb 0 0 0 0 0 0 0 0 0 0 0 s w a a p from master s = start condition w = write a = acknowledge from slave p = stop condition r = read n = not acknowledge command device address device address cmd byte
ms5803-30ba miniature 30 bar module sensor solutions ///ms5803-30ba 09/2015 page 14 prom read sequence the prom read command consists of two parts. first command sets up the system into prom read mode. the second part gets the data from the system. figure 14: i 2 c command to read memory address= 011 (coefficient 3) figure 15: i 2 c answer from ms5803-30ba cyclic redundancy check (crc) ms5803-30ba contains a prom memory with 128-bit. a 4-bit crc has been implemented to check the data validity in memory. the application note an520 describes in detail crc-4 code used. a d d d b 1 5 d b 14 d b 13 d b 12 d b 11 d b 10 d b 9 d b 8 d b 7 d b 6 d b 5 d b 4 d b 3 d b 2 d b 1 d b 0 0 16 bit reserved for manufacturer 1 coefficient 1 (16 bit unsigned) 2 coefficient 2 (16 bit unsigned) 3 coefficient 3 (16 bit unsigned) 4 coefficient 4 (16 bit unsigned) 5 coefficient 5 (16 bit unsigned) 6 coefficient 6 (16 bit unsigned) 7 crc figure 16: memory prom mapping 1 1 1 0 1 1 csb 0 0 1 0 1 0 0 1 1 0 0 s w a a p from master s = start condition w = write a = acknowledge from slave p = stop condition r = read n = not acknowledge command device address device address cmd byte
ms5803-30ba miniature 30 bar module sensor solutions ///ms5803-30ba 09/2015 page 15 application circuit the ms5803-30ba is a circuit that can be used in conjunction with a microc ontroller in mobile depth-meter applications. it is designed for low-voltage systems with a supply voltage of 3 v. ms5803-30ba ms5803-30ba figure 17: typical application circuit with spi / i 2 c protocol communication
ms5803-30ba miniature 30 bar module sensor solutions ///ms5803-30ba 09/2015 page 16 package outline and pin configuration top view pin name type function 1 sclk i serial data clock 2 gnd g ground 3 csb i chip select (active low) 4 nc nc - 5 vdd p positive supply voltage 6 ps i communication protocol select spi / i2c 7 sdi/sda i serial data input 8 sdo o serial data output 8 1 7 2 6 3 5 4 5 4 6 3 7 2 8 1 figure 18: ms5803-30ba package outlines, pin configuration and d escription notes: (1) dimensions in mm (2) general tolerance 0.1 (3) cap centering 0.15 from center of the ceramic recommended pad layout
ms5803-30ba miniature 30 bar module sensor solutions ///ms5803-30ba 09/2015 page 17 shipping package tube tape & reel
ms5803-30ba miniature 30 bar module sensor solutions ///ms5803-30ba 09/2015 page 18 mounting and assembly considerations soldering please refer to the application note an808 available on our website for all soldering issues. mounting the ms5803-30ba can be placed with automatic pick & place equipment usin g vacuum nozzles. it will not be damaged by the vacuum. due to the low stress assembly the sensor does not show pressure hysteresis effects. it is important to solder all contact pads. connection to pcb the package outline of the module allows the use of a flexible pcb for interco nnection. this can be important for applications in watches and other special devices. sealing with o-rings in products like outdoor watches the electronics must be protected against direct water or humidity. for those products the ms5803-30ba provides the possibility to seal with an o-ring. the protective cap of the ms5803-30ba is made of special anticorrosive stainless steel with a polished surface. in addition to this the ms5803-30ba is filled with silicone gel covering the sensor and the bonding wires. the o-ring (or o-rings) shall be placed at the outer diameter of the metal cap. this method avoids mechanical stress because the sens or can move in vertical direction. cleaning the ms5803-30ba has been manufactured under cleanroom conditions. it is therefore reco mmended to assemble the sensor under class 10000 or better conditions. should this not be possible, it is recommended to protect the sensor opening during assembly from entering particles and dust. to avoid cl eaning of the pcb, solder paste of type no - clean shall be used. cleaning might damage the sensor! esd precautions the electrical contact pads are protected against esd up to 4 kv hbm (human bod y model). it is therefore essential to ground machines and personnel properly during assembly and handling of the devi ce. the ms5803-30ba is shipped in antistatic transport boxes. any test adapters or production transport boxes used during the assembly of the sensor shall be of an equivalent antistatic material. decoupling capacitor particular care must be taken when connecting the device to the power supply. a minimum 100nf ceramic capacitor must be placed as close as possible to the ms5803-30ba vdd pin. this c apacitor will stabilize the power supply during data conversion and thus, provide the highest possible accuracy.
ms5803-30ba miniature 30 bar module sensor solutions ///ms5803-30ba 09/2015 page 19 ordering information part number / art. number product delivery form ms580330ba01- 00 ms5803-30ba miniature module tube ms580330ba01- 50 ms5803-30ba miniature module t&r tape & reel ms580330ba06- 00 ms5803-30ba miniature module he tube ms580330ba06- 50 ms5803-30ba miniature module he t&r tape & reel te.com/sensorsolutions measurement specialties, inc., a te connectivity company. measurement specialties, te connectivity, te connectivity (logo) and ev ery connection counts are trademarks. all other logos, products and/o r company names referred to herein might be trademarks of their respective owners. the information given herein, including drawings, illustrations and schematics which are intended for illustration purposes only, is beli eved to be reliable. however, te connectivity makes no warranties as to its accuracy or completeness and disclaims a ny liability in connection with its use. te conn ectivitys obligations shall only be as set forth in te connectivitys sta ndard terms and conditions of sale for this product and in no case will t e connectivity be liable for any incidental, indirect or consequ ential damages arising out of the sale, resale, use or misuse of the product. users of te connectivity products should make their own evaluat ion to determine the suitability of each such product for the specific ap plication. ? 2015 te connectivity ltd. family of companies all rights reserved. da5803-30ba_007 000058031759 ecn2319 north america measurement specialties, inc., a te connectivity company 45738 northport loop west fremont, ca 94538 tel: +1 800 767 1888 fax: +1 510 498 1578 e-mail: pfg.cs.amer@meas-spec.com website: www.meas-spec.com europe measurement specialties (europe), ltd., a te connectivity company switzerland srl ch. chapons-des-prs 11 ch -2022 bevaix tel: +41 32 847 9550 fax: + 41 32 847 9569 e-mail: sales.ch@meas-spec.com website: www.meas-spec.com asia measurement specialties (china), ltd., a te connectivity company no. 26 langshan road shenzhen high-tech park (north) nanshan district, shenzhen, 518057 china tel: +86 755 3330 5088 fax: +86 755 3330 5099 e-mail: pfg.cs.asia@meas-spec.com website: www.meas-spec.com

▲Up To Search▲

Price & Availability of MS580330BA01-00

	To Download MS580330BA01-00 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .